• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Method for equipping electronic circuit boards with optical components. The invention relates to a method for equipping electronic circuit boards with optical components, wherein the optical components are measured and positioned by means of image processing systems, with the following method steps: - the optical components are measured before the actual placement process, preferably in the feed belt and the position of the optically relevant elements determined in relation to the entire component and calculated therefrom a first factor Cor, from at least one further correction factor is calculated from reference points present in the printed circuit board for further optical components, during the assembly process the predetermined installation positions are corrected with the correction factors and an actual installation position is determined; The optical components are placed on the actual mounting position. For a precise positioning of the optical components to each other is possible.
    公开号:AT514599A4
    申请号:T50443/2013
    申请日:2013-07-05
    公开日:2015-02-15
    发明作者:Rainer Ing Egger；Leopold Ing Hellinger；Gerhard Ing Neumann
    申请人:Melecs Ews Gmbh & Co Kg；
    IPC主号:
    专利说明:

    Description / Description
    Method for equipping electronic circuit boards with optical components.
    The invention relates to a method for equipping electronic circuit boards with optical components.
    When components of component carriers (for example printed circuit boards) are equipped with components, so-called placement machines are used. The components are usually provided by a component feeder at certain pickup positions and picked up from there by a placement. The placement head can be freely positioned within a workspace by means of a positioning system. After picking up the components are transported from the placement to a Bestückposition and placed on the component carrier to be populated at predetermined installation positions, which are defined by corresponding electrical pads.
    Due to the increasing miniaturization of electronic components, a precise placement process is only possible by accurate measurement and inspection of the objects or components picked up by the placement head. In this case, the objects or components have features or groups of features (for example, corners, edges, component connections, centering pins, markings, etc.), from which information about the type and position of the component is given. For a measurement and inspection of objects, in particular components, in placement machines usually image processing systems are used. In this case, for measuring and inspecting the object or the electronic component that has been recorded by a placement, the placement or a corresponding holding device relative to a camera (eg, component camera) of the image processing system is positioned so that to be measured and inspi decorative object in the field of view of the camera. The actual measurement and inspection - and thus the recognition of the object or component and its position - then takes place by means of image processing processes by the image processing system. An exemplary device for mounting electronic components is known from EP 1282350 Bl.
    The known procedures lead to unsatisfactory results, in particular in the assembly of optical components, since, for example, in light emitting diodes in SMD construction, the light-emitting surface does not have an exactly predictable position within the housing. The positioning based on the housing dimensions is therefore not precise enough. This is especially true if the optical properties of an overall system are determined by a plurality of components such as light-emitting diodes and reflectors.
    The invention is therefore based on the object to improve the positioning of optical components.
    According to the invention, this is done with a method according to claim 1.
    Advantageous embodiments emerge from the subclaims.
    The invention will be explained in more detail with reference to an embodiment which shows the sequence of the method according to the invention in the assembly of a headlamp in a schematic way.
    To further illustrate the figures serve. 1 shows schematically a light emitting diode in SMD construction and FIG. 2 shows schematically the structure of a headlight.
    This headlamp comprises, in addition to a printed circuit board 5 as a base body at least one light emitting diode in SMD construction 1 and one or more reflectors 6, and optionally also not shown here lens systems. For the optical operation of the precise arrangement of light-emitting diodes 1 and reflectors 6 to each other is essential. Errors in the positioning of the individual components can accumulate in a worst-case scenario and thus assume inadmissible values.
    According to the invention, a precise alignment of the optical components is now carried out by a plurality of measures:
    Thus, the exact position of the light-radiating surface 2 within the housing of the LEDs in SMD construction 1 is determined and calculated from a first correction factor. This determination is made before the actual placement process with its own camera system, while the LEDs are still in the component feeder, e.g. a feeding belt.
    In Fig. 1, this position of the light-emitting surface 2 is shown within the housing of the light emitting diodes in SMD construction 1 by a second geometric Achsenkreuz 4 of the light-emitting surface. This second coordinate system 4 indicates the optically relevant center of the light-emitting diode 1. This optical center does not match the geometric center of the light-emitting diode 1 defined by the first geometric coordinate system 3 of the light-emitting diode. The deviation between the two coordinate systems 3, 4 is detected by means of the first correction factor, a two-dimensional vector.
    Furthermore, reference points for further optical components are determined and measured. Holes 7 in the printed circuit board 5, which are provided for the attachment of the reflectors 6 or of lens systems, are particularly suitable as further reference points.
    From the measures for the other reference points, i. the bores 7 provided for the reflectors 6, at least one further correction factor is calculated.
    It should be noted that the correction factors represent two-dimensional vectors which include a correction in both the x-direction and the y-direction of a coordinate system arranged in the plane of the printed circuit board.
    Through this direct relation to the holes 7 provided for the reflectors 6, a possible chain defect formation is avoided and the accuracy of the assembly is further increased.
    At the thus determined actual installation position, the light emitting diodes are finally placed in SMD construction 1.
    After the further components 6 have been provided, as well as possibly further electronic components provided for the control of the headlight, the method is soldered using known suitable methods or a conductive adhesive method is used.
    Reference symbols 1 LED in SMD Construction 2 Light-radiating surface 3 First geometrical coordinate system of the light-emitting diode 4 Second geometric coordinate system of the light-radiating surface 5 Circuit board 6 Reflector 7 Holes for reflector
    权利要求:
    Claims (4)
    [1]
    A method for assembling electronic circuit boards (5) with optical components (1), wherein the optical components (1,6) are measured and positioned by means of image processing systems, comprising the steps of: - the optical components (1) before the actual placement process, preferably measured in the feed belt and determines the position (4) of the optically relevant elements (2) in relation to the overall component (1) and calculates a first correction factor, - from in the circuit board (5) existing reference points (7) for further optical components (6) at least one further correction factor is calculated, - during the assembly process, the predetermined installation positions are corrected with the correction factors and an actual installation position determined, - the optical components (1) are placed on the actual installation position.
    [2]
    2. The method according to claim 1, characterized in that as optical components (1) LEDs are provided in SMD construction.
    [3]
    3. The method according to claim 1 or 2, characterized in that as further optical components (6) reflectors and / or lens systems are provided.
    [4]
    4. The method according to claim 3, characterized in that as in the circuit board (5) existing reference points for other optical components (6) holes (7) are used for fixing reflectors and / or lens systems.
    类似技术:
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    同族专利:
    公开号 | 公开日
    EP3017667B1|2020-03-18|
    WO2015000894A1|2015-01-08|
    AT514599B1|2015-02-15|
    EP3017667A1|2016-05-11|
    引用文献:
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    US20090090002A1|2007-10-05|2009-04-09|Sony Corporation|Method of manufacturing an electronic component substrate|
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    US20100053929A1|2008-08-26|2010-03-04|Jeffrey Bisberg|LED Packaging Methods And LED-Based Lighting Products|
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    KR20110060868A|2011-01-25|2011-06-08|삼성엘이디 주식회사|Heat sink board and manufacturing method thereof, light emitting diode package module having the same and manufacturing method thereof|DE102015012825A1|2015-10-02|2016-04-28|Daimler Ag|Method for equipping an already equipped printed circuit board|DE60119090T2|2001-07-20|2006-11-30|Hitachi High-Tech Instruments Co., Ltd.|Device for mounting electronic components|
    JP5301548B2|2007-09-20|2013-09-25|コーニンクレッカフィリップスエレクトロニクスエヌヴィ|LED package and method for manufacturing the LED package|
    FR2950129B1|2009-09-14|2011-12-09|Valeo Vision|LIGHTING AND / OR SIGNALING DEVICE FOR A MOTOR VEHICLE.|
    JP2011128290A|2009-12-16|2011-06-30|Hitachi High-Technologies Corp|Light source device, and backlight, exposure device and exposure method using the same|
    US20110293168A1|2010-05-25|2011-12-01|Yoshihiko Matsushima|Method for mounting transparent component|
    AT513747B1|2013-02-28|2014-07-15|Mikroelektronik Ges Mit Beschränkter Haftung Ab|Assembly process for circuit carriers and circuit carriers|AT517259B1|2015-06-09|2020-01-15|Zkw Group Gmbh|Process for the exact placement of a circuit carrier|
    DE102016201206A1|2016-01-27|2017-07-27|Automotive Lighting Reutlingen Gmbh|Method for processing a holding device for a light module of a lighting device of a motor vehicle|
    DE102016102637A1|2016-02-15|2017-08-17|Automotive Lighting Reutlingen Gmbh|Method for producing a light module of a motor vehicle lighting device and light module|
    DE102016108260A1|2016-05-04|2017-11-09|Automotive Lighting Reutlingen Gmbh|Method for arranging a circuit carrier and device for arranging a circuit carrier|
    DE102016119792A1|2016-10-18|2018-04-19|Automotive Lighting Reutlingen Gmbh|Method for arranging a circuit carrier and illumination device for a motor vehicle with a circuit carrier arranged according to this method|
    法律状态:
    优先权:
    申请号 | 申请日 | 专利标题
    ATA50443/2013A|AT514599B1|2013-07-05|2013-07-05|Method for equipping electronic circuit boards with optical components|ATA50443/2013A| AT514599B1|2013-07-05|2013-07-05|Method for equipping electronic circuit boards with optical components|
    EP14735557.2A| EP3017667B1|2013-07-05|2014-07-01|Method for fitting optical components to electronic printed circuit boards|
    PCT/EP2014/063951| WO2015000894A1|2013-07-05|2014-07-01|Method for fitting optical components to electronic printed circuit boards|
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